HOZAN Lead-Free Solder, Sn-3Ag-0.5Cu, 0.8mm Diameter, 400g, HS-313

This lead-free solder contains 3% silver. This alloy is recommended by JEITA and has been used since the early days of the lead-free era, making it a highly reliable and proven solder. It uses a flux that minimizes spatter. For soldering precision electronic devices. Wire diameter (mm): 0.8 Weight (g): 400 Composition (%): Ag3/Sn96.5/Cu0.5 Melting point: 217-220°C Length (reference value): 130m / Alloy composition (tin: 96.5%, silver: 3.0%, copper: 0.5%)