Feature:
1. Free Movement: The BGA repair blade is very thin and light, so it can move freely between the chip and the substrate.
2. Safe and Practical: IC chip repair thin blade is easy to operate, no drop point, no copper skin, easy to clean, safe and practical.
3. Anti Oxidation: IC chip repair thin blade has heat resistance, low temperature resistance, anti oxidation, corrosion resistance, good wear resistance, toughness.
4. Light Weight: BGA repair blade is overall light weight, very easy to carry, you can carry around at any time when you need.
5. Wide Application: BGA repair blades are widely used in power supply removal, chip removal, CPU glue shovelling, baseband removal, edge glue removal, edge glue cutting, etc. in addition to repairing BGA chips.
Specification:
Item Type: BGA Repair Blade
Material: SK5 Steel.
Package List:
12 x BGA Repair BladeFree Movement: The BGA repair blade is very thin and light, so it can move freely between the chip and the substrate.
Safe and Practical: IC chip repair thin blade is easy to operate, no drop point, no copper skin, easy to clean, safe and practical.
Anti Oxidation: IC chip repair thin blade has heat resistance, low temperature resistance, anti oxidation, corrosion resistance, good wear resistance, toughness.
Light Weight: BGA repair blade is overall light weight, very easy to carry, you can carry around at any time when you need.
Wide Application: BGA repair blades are widely used in power supply removal, chip removal, CPU glue shovelling, baseband removal, edge glue removal, edge glue cutting, etc. in addition to repairing BGA chips.
